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 Flexible Printed Circuits: Frequently Asked Questions

Flexible Printed Circuits: Frequently Asked Questions


As a manufacturer of flexible boards, we serve a large number of flexible board customer cases. Such as flexible PCB deisgn, prototyping and production. in the process we have accumulated questions about FAQ of flexible Circuits.

What is Flexible PCB (FPC)?

A Flexible Printed Circuit (FPC), often referred to as a flexible circuit or flex circuit. That is a type of electronic circuit that manufactured using flexible. bendable materials instead of traditional rigid substrates like printed circuit boards (PCBs). FPCs designed to be more adaptable to various shapes and applications. making them suitable for situations where space constraints. complex layouts, or dynamic movement involved.

FPCs consist of conductive traces and components. (such as resistors, capacitors, and integrated circuits). that are directly printed, etched, or bonded onto flexible substrates. typically made from materials like polyimide or polyester. These materials chosen for their ability to withstand bending, twisting. and flexing without compromising the circuit’s integrity.

2.What Materials For Flexible Circuit ?

Flexible circuits, also known as FPCs (Flexible Printed Circuits). That made from various materials that provide the necessary combination of flexibility. electrical conductivity, and durability. The choice of materials depends on factors such as the intended application. performance requirements, and manufacturing processes. Some common materials used in flexible circuits include:

Polyimide (PI):

Polyimide is one of the most widely used materials for flexible circuit substrates. It offers excellent thermal stability, electrical insulation, and mechanical flexibility. It can withstand high temperatures, making it suitable for applications that involve heat.

Polyester (PET):

Polyester films are more cost-effective compared to polyimide. They provide good electrical insulation properties and are often used in applications. where high-temperature resistance is not a critical requirement.

Polyethylene Naphthalate (PEN):

PEN films offer properties similar to polyimide. but can be a more cost-effective alternative. They provide good electrical performance and mechanical flexibility.

Flexible Photopolymer: Photopolymer-based materials used for flexible circuits. that produced using additive printing processes, such as inkjet printing.

3.How are Flexible Circuits Different To Rigid PCBs?

Flexible circuits and rigid printed circuit boards (PCBs). That are two distinct types of electronic interconnect solutions. each with its own advantages and applications. Here are some key differences between flexible circuits and rigid PCBs:

Flexibility and Bending Capability:

Flexible Circuits: As the name suggests, flexible circuits bent. twisted, and folded to varying degrees without compromising their functionality. They are ideal for applications that involve dynamic movement, irregular shapes, or tight spaces.

Rigid PCBs: Rigid PCBs made from inflexible materials and cannot bent or flexed. They maintain their shape and structure. making them suitable for applications that don’t require flexibility.

Form Factor and Design Freedom:

Flexible Circuits: Flexible circuits allow for innovative and unconventional designs. due to their ability to conform to different shapes and contours. This is advantageous for devices with non-traditional form factors or unconventional layouts.

Rigid PCBs: Rigid PCBs limited to flat, planar designs. While they designed with complex layouts. they are less suitable for applications where shape adaptation required.

Weight and Size:

Flexible Circuits: Flexible circuits are generally lighter and thinner than rigid PCBs. making them suitable for lightweight and compact devices.

Rigid PCBs: Rigid PCBs can be thicker and heavier due to their inflexible nature.


Flexible Circuits: Flexible circuits are commonly used in applications. where movement, space constraints, or complex shapes involved. Examples include wearable devices, medical devices, automotive components, and flexible displays.

Rigid PCBs: Rigid PCBs used in a wide range of applications. including consumer electronics, industrial equipment, computers. and most electronic devices where flexibility is not a requirement.

Manufacturing Processes:

Flexible Circuits: The manufacturing processes for flexible circuits involve using flexible substrates. such as polyimide or polyester, and specialized techniques to create flexible interconnects. These processes can include additive printing, etching, and lamination.

Rigid PCBs: Rigid PCBs are typically manufactured using rigid substrates. such as fiberglass-based epoxy materials, through processes like etching, drilling, and soldering.

Cost Considerations:

Flexible Circuits: The manufacturing processes for flexible circuits can be more complex and specialized. potentially leading to higher production costs compared to rigid PCBs.

Rigid PCBs: Rigid PCB manufacturing processes are well-established. and can often be more cost-effective, especially for higher volumes.

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4.What Are The Benefits of Flexible Design?

A flexible design in the context of electronics, particularly flexible circuits and systems. offers several benefits that can be advantageous in various applications. Here are some of the key benefits of a flexible design:

Conformity to Shapes and Surfaces:

Flexible designs can conform to non-planar shapes, curves, and irregular surfaces. This is particularly useful in applications where the available space limited. or where the device needs to fit into unconventional or tight spaces.

Compact Form Factors:

Flexible designs allow for compact and space-efficient layouts. This is especially important in modern electronics where miniaturization is a key trend. Devices with flexible designs can achieve higher component density without sacrificing performance.

Weight Reduction:

Flexible designs often use lightweight materials, resulting in lighter overall devices. This is advantageous in applications where weight is a critical factor. such as wearable devices or aerospace applications.

Flexibility and Bending Capability:

The ability of flexible designs to bend, twist, and flex without breaking. or losing functionality makes them ideal for applications involving movement. such as robotics, wearable health monitors, and flexible displays.

Shock and Vibration Resistance:

Flexible designs can absorb and dissipate mechanical stress. and vibrations better than rigid counterparts. This is important in applications where the device is subject to external forces. such as automotive electronics or industrial equipment.

Higher Reliability:

Flexible designs can reduce the number of solder joints and connectors compared to rigid designs. Fewer solder joints mean lower chances of failure. due to solder fatigue, which can lead to improved overall reliability.

Innovative and Unique Applications:

Flexible designs enable the creation of innovative and unique products. that would be difficult to achieve with rigid designs. Examples include flexible displays, smart textiles. and wearable technology that seamlessly integrates into clothing.

Customization and Tailoring:

Flexible designs customized to fit specific requirements and unique shapes. This level of tailoring is valuable in applications. where a one-size-fits-all approach is not suitable.

Improved Durability:

Flexible designs can withstand repeated bending and flexing. making them more durable in certain conditions. This is particularly beneficial in applications. where the device subjected to frequent handling or movement.

Reduced Assembly Complexity:

In some cases, flexible designs can simplify the assembly process by eliminating the need for connectors, cables. and complex interconnects, which can result in cost savings and improved assembly efficiency.

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5.What Are The Benefits of Flexible Circuits?

Flexible circuits offer several benefits that make them a valuable solution for a wide range of applications. Here are some of the key benefits of using flexible circuits:


Space Efficiency:

Flexible circuits designed to fit into tight or unconventional spaces. where traditional rigid PCBs cannot be easily accommodated. This makes them ideal for miniaturized and compact electronic devices.

Weight Reduction:

The lightweight nature of flexible circuits is advantageous in applications. where weight is a concern, such as aerospace, automotive, and wearable technology.

Reduced Packaging Complexity:

Flexible circuits can eliminate the need for bulky connectors and cables. Components can be directly bonded to the flexible substrate. reducing the overall size of the device and simplifying the assembly process.

Dynamic Applications:

Flexible circuits can withstand repeated bending, flexing, and twisting without compromising their functionality. This makes them suitable for applications involving movement or vibration. such as robotics and portable devices.

Improved Reliability:

Flexible circuits have fewer solder joints and interconnects compared to rigid PCBs. reducing the potential points of failure due to solder fatigue. This can enhance the overall reliability of the device.

Higher Density:

Flexible circuits can accommodate a high density of components and traces. allowing for complex circuitry and miniaturization. This is beneficial for applications that require a lot of functionality in a small space.

Design Flexibility:

Flexible circuits designed with various layers, bends. and shapes to meet specific design requirements. This level of flexibility is useful for creating custom solutions tailored to unique applications.

Cost Savings:

In some cases, the reduced need for connectors, cables. and assembly steps can lead to cost savings during production and assembly. Additionally, the lightweight design can reduce shipping costs.

Resistance to Environmental Factors:

Flexible circuits designed to be more resistant to environmental factors. such as moisture, chemicals, and temperature fluctuations. depending on the choice of materials and protective coatings.

Innovative Applications:

Flexible circuits enable the development of innovative products. that push the boundaries of traditional electronics. Examples include flexible displays, wearable health monitors, and foldable smartphones.

Ease of Integration:

Flexible circuits integrated into various materials and structures. allowing for seamless integration into everyday objects and environments.


Flexible circuits customized to specific shapes and layouts. allowing for a high degree of design freedom and tailoring to the needs of the application.

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6.How Much Does Flexible PCB/FPC Weight?

The weight of a flexible PCB (FPC) can vary widely depending on several factors. including the size of the circuit, the thickness and type of flexible substrate used. the number of layers, the type and density of components. and any additional materials such as adhesive layers or protective coatings. As a result, it’s challenging to provide a specific weight. without knowing the detailed specifications of the FPC in question.

7. How Easy Does That To Attach Components To The Flexible Circuit?

Attaching components to a flexible circuit (FPC) is a specialized process. that requires careful consideration of the flexible nature of the substrate. While the process shares similarities with components to rigid printed circuit boards (PCBs). there are certain differences and challenges that need to addressed. Here’s an overview of the factors that affect how easy it is to attach components to a flexible circuit:

Flexibility and Handling:

Flexible circuits can be delicate and prone to damage if not handled properly. Components need to attached with care to avoid putting undue stress on the circuit during assembly. Special handling techniques and tools required to prevent bending or tearing.

Adhesive Selection:

Depending on the design and application, components attached using adhesives or conductive adhesives. The choice of adhesive is critical to ensure proper bonding without affecting the flexibility of the circuit.

Component Type:

Surface-mount components are generally more compatible with flexible circuits. due to their compact size and light weight. Through-hole components can also used but may require additional reinforcement. to prevent damage from stress during bending.

Soldering Techniques:

Soldering components to a flexible circuit can be more challenging. due to the potential for heat transfer and thermal expansion to affect the flexible substrate. Low-temperature soldering techniques. and specialized solder masks used to mitigate these issues.

Placement Accuracy:

The accuracy of component placement is crucial to ensure. that components aligned correctly with the traces and pads on the flexible circuit. Precision placement equipment and techniques are often used to achieve accurate positioning.

Stress Relief and Bending Zones:

When attaching components to a flexible circuit. it’s important to consider the areas where the circuit may bend or flex. Components placed strategically to avoid placing stress on critical bending zones.

Testing and Inspection:

After components attached, thorough testing and inspection are necessary. to ensure that the connections are secure and the circuit functions as intended. These steps are essential to catch any defects early in the process.

Design Considerations:

Designing the circuit layout with component attachment in mind can help the assembly process. Proper pad sizes, clear component outlines. and accessible placement areas can simplify the component attachment process.

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8. Does Flexible Circuit Cost More Than Rigid PCBs?

Flexible circuits (FPCs) can be more expensive to manufacture than traditional rigid PCBs. but the cost difference depends on various factors. Here are some factors that can influence the cost comparison between flexible circuits and rigid PCBs:

Material Costs:

The materials used in flexible circuits, such as flexible substrates like polyimide or polyester. can be more expensive than the rigid materials typically used in PCBs. However, the cost difference can vary based on the specific materials chosen and their availability.

Manufacturing Complexity:

The manufacturing processes for flexible circuits can be more complex. and specialized than those for rigid PCBs. Processes such as etching, lamination, and additive printing used, adding to the overall cost.

Design Complexity:

Complex designs with multiple layers, intricate routing. and unique shapes can increase the cost of both flexible circuits and rigid PCBs. Flexible circuits can sometimes require additional design considerations. due to the need for bend zones and stress relief.

Component Attachment:

Attaching components to flexible circuits may require specialized techniques, materials. or equipment, which can impact the overall cost.

Volume of Production:

The economies of scale play a role in determining the cost difference. Larger production volumes can help spread fixed costs. potentially reducing the cost per unit for both flexible circuits and rigid PCBs.


The level of customization required for the circuit design and specifications can affect the cost. Customized flexible circuits with unique requirements may be more expensive to produce.

Prototyping vs. Mass Production:

Prototyping small quantities of flexible circuits can be relatively expensive. due to setup costs and lower economies of scale. Mass production can help reduce costs per unit.

Additional Features:

Additional features such as protective coatings, gold plating, impedance control. and controlled dielectric constant can add to the cost of both flexible circuits and rigid PCBs.

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9.Do You Have a Variety Of Flexible Electronics Manufacturing Options?

Yes, there are multiple manufacturing options for flexible electronics. each with its own processes and techniques. The choice of manufacturing method depends on factors. such as the complexity of the design, the required volume of production. the materials used, and the desired level of precision. Here are some common manufacturing options for flexible electronics:

Etching-Based Processes:

  • Laser Ablation: Laser technology used to selectively remove material from flexible substrates. creating circuit traces, pads, and vias. It’s suitable for high-precision applications.
  • Chemical Etching: Chemical etching involves using chemicals to remove material from the substrate. This process is suitable for producing fine traces and patterns.

Additive Printing:

  • Inkjet Printing: Insulating inks printed onto the flexible substrate layer to create circuitry. This is a versatile and cost-effective method, suitable for prototyping and low-volume production.
  • Screen Printing: Screen printing uses a stencil to apply conductive and insulating inks. It’s useful for larger features and less intricate designs.


Photolithography: Photolithography uses photoresist and light exposure to create patterns on the substrate. It’s suitable for high-precision applications.

Roll-to-Roll (R2R) Manufacturing:

R2R Printing: This continuous manufacturing process involves printing conductive. and functional inks onto flexible substrates that are wound onto rolls. It’s suitable for high-volume production of flexible electronics.

Deposition Techniques:

  • Physical Vapor Deposition (PVD): PVD methods like sputtering and evaporation. deposit thin films of conductive materials onto flexible substrates. This is often used for creating thin conductive layers.
  • Chemical Vapor Deposition (CVD): CVD deposits thin films of materials through chemical reactions. It’s suitable for depositing insulating or semiconducting layers.

3D Printing:

3D Printing: In some cases, 3D printing techniques adapted for creating flexible electronics. by combining conductive and non-conductive materials layer by layer.

Hybrid Manufacturing:

Hybrid Approaches: Some manufacturers combine multiple techniques. such as combining printing with etching or deposition, to achieve specific design requirements.

Assembly and Integration:

Attaching components to flexible substrates often involves specialized techniques. such as conductive adhesives, soldering with low-temperature solders, and flip-chip bonding.

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10.What Information Do You Need For Quick Quotations?

To obtain quick and accurate quotations for your flexible electronics project. it’s important to provide manufacturers with comprehensive information. About your design requirements and production needs. Here’s a list of key information you should include when requesting quotations:

FAQ of flexible circuits

Design Specifications:

  • Detailed description of the product or device you are creating with flexible electronics.
  • Schematic diagrams and layout files (Gerber files) if available.

Quantity and Volume:

The expected production volume or quantity you need. Manufacturers often offer different pricing tiers for different quantities.

Flexible Circuit Design:

  • Number of layers in the flexible circuit.
  • Dimensions and shape of the flexible circuit.
  • Circuit complexity (number of traces, components, pads, etc.).
  • Required bending and flexing characteristics.


  • Type of flexible substrate material (e.g., polyimide, polyester).
  • Thickness of the flexible substrate.
  • Any additional layers, coatings, or reinforcements.


  • List of components to attached to the flexible circuit.
  • Component types (surface-mount, through-hole, etc.).
  • Component sizes and footprints.

Tolerances and Specifications:

  • Tolerances for trace widths, spacing, pad sizes, and other design features.
  • Any specific electrical performance requirements (impedance, capacitance, resistance, etc.).

Special Features:

Any special features or requirements, such as impedance control. EMI shielding, conformal coatings, etc.

Testing and Inspection:

Any required testing, quality control, or inspection procedures.

Lead Time:

Desired or required production lead time.

Additional Services:

Any additional services you might need, such as assembly, component sourcing, or packaging.

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